Taekoo Lee : rechercher sur Z-Library

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1

Finite element analysis for solder ball failures in chip scale package

Taekoo Lee, Jinhyuk Lee, Ilgyu Jung

Journal:

Microelectronics Reliability

Année:

1998

Langue:

english

Fichier:

PDF, 414 KB

english, 1998

2

Board level drop test and simulation of leaded and lead-free BGA-PCB assembly

Xin Qu, Zhaoyi Chen, Bo Qi, Taekoo Lee, Jiaji Wang

Journal:

Microelectronics Reliability

Année:

2007

Langue:

english

Fichier:

PDF, 2.25 MB

english, 2007

3

[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - Insulation Degradation and Bias Acceleration Effect Study under THB Test

Zhou, Jianwei, Zheng, Wei, Lou, Minyi, Lee, Taekoo

Année:

2007

Langue:

english

Fichier:

PDF, 1.10 MB

english, 2007

4

[IEEE 2006 7th International Conference on Electronic Packaging Technology - Shanghai, China (2006.08.26-2006.08.29)] 2006 7th International Conference on Electronic Packaging Technology - Board Level Drop Test Reliability for MCP Package

Zhang, Jing, Du, Maohua, Feng, Nufeng, Lee, Taekoo

Année:

2006

Langue:

english

Fichier:

PDF, 3.69 MB

english, 2006

5

[IEEE 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (21-25 July 1997)] Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Finite element analysis for solder ball failures in chip scale package

Taekoo Lee,, Jinhyuk Lee,, Ilgyu Jung,

Année:

1997

Langue:

english

Fichier:

PDF, 747 KB

english, 1997

6

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Study of glass metallization and adhesion evaluation for TGV application

Chen, Le, Wang, Qian, Cai, Jian, Ma, Guangrui, Hu, Yang, Lee, Taekoo

Année:

2013

Langue:

english

Fichier:

PDF, 415 KB

english, 2013

7

[IEEE 2006 7th International Conference on Electronic Packaging Technology - Shanghai, China (2006.08.26-2006.08.29)] 2006 7th International Conference on Electronic Packaging Technology - Solution for the Board Level Drop Test in Vertical Direction of BGA Package under Ultrahigh Acceleration

Chen, Zhaoyi, Qi, Bo, Wang, Jiaji, Lee, Taekoo

Année:

2006

Langue:

english

Fichier:

PDF, 4.57 MB

english, 2006

8

[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - Characteristics of Tin Whisker Growth on Matte Tin Surface Finishes by Acceleration Conditions

Zhao, Fang, Wang, Qian, Lee, Taekoo

Année:

2007

Langue:

english

Fichier:

PDF, 1.56 MB

english, 2007

9

[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - Mechanical Test and Analysis on Reliability of Lead-free BGA Assembly

XiaoKun Zhu,, Bo Qi,, Xin Qu,, JiaJi Wang,, Taekoo Lee,, Hui Wang,

Année:

2005

Langue:

english

Fichier:

PDF, 449 KB

english, 2005

10

[IEEE 2006 7th International Conference on Electronic Packaging Technology - Shanghai, China (2006.08.26-2006.08.29)] 2006 7th International Conference on Electronic Packaging Technology - Solder Joint Thermal Fatigue Analysis of 48-FBGA

Chen, Song, Lee, Taekoo, Lee, Jaisun, Feng, Nufeng

Année:

2006

Langue:

english

Fichier:

PDF, 3.49 MB

english, 2006

11

[IEEE 2006 7th International Conference on Electronic Packaging Technology - Shanghai, China (2006.08.26-2006.08.29)] 2006 7th International Conference on Electronic Packaging Technology - Simulation of Average Strain Energy Density (SED) in the BGA Soldering during the Drop Test

Tao, Jianlei, Qu, Xin, Wang, Jiaji, Lee, Taekoo

Année:

2006

Langue:

english

Fichier:

PDF, 4.92 MB

english, 2006

12

[IEEE 2006 7th International Conference on Electronic Packaging Technology - Shanghai, China (2006.08.26-2006.08.29)] 2006 7th International Conference on Electronic Packaging Technology - Drop Test Failure Analysis of SAC BGA Solder Joints Using Ni/Au and Cu-OSP Pad Finish

Xie, Xiaoqiang, Wang, Lei, Lee, Taekoo

Année:

2006

Langue:

english

Fichier:

PDF, 3.24 MB

english, 2006

13

[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - Board Level FBGA Package Combined Thermal Cycling & Bending Fatigue Study

Hui Wang,, Jianwei Zhou,, Taekoo Lee,, Jun Wang,, Fei Xiao,

Année:

2005

Langue:

english

Fichier:

PDF, 454 KB

english, 2005

14

[IEEE 2006 7th International Conference on Electronic Packaging Technology - Shanghai, China (2006.08.26-2006.08.29)] 2006 7th International Conference on Electronic Packaging Technology - Interfacial Reaction and Joint Reliability of Sn-Ag-Cu/OSP-Cu Pad SMT Solder Joint

Wang, Lei, Xie, Xiaoqiang, Lee, Taekoo

Année:

2006

Langue:

english

Fichier:

PDF, 4.73 MB

english, 2006

15

[IEEE Nineteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium - San Jose, CA, USA (11-13 March 2003)] Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003. - Thermal characterization of high speed DDR devices in system environments [DRAM modules]

Joonghyun Baek,, Byungse So,, Taekoo Lee,, Yunhyeok Im,, Seyong Oh,

Année:

2003

Langue:

english

Fichier:

PDF, 489 KB

english, 2003

16

[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - Lifetime Assessment of Solder Joints of BGA Package in Board Level Drop Test

Lou Haohuan,, Qu Xin,, Chen zhaoyi,, Wang Jiaji,, Taekoo Lee,, Hui Wang,

Année:

2005

Langue:

english

Fichier:

PDF, 319 KB

english, 2005

17

[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - Board Level Thermal Cycle Reliability of BGA for a New Type of Pad Structure with OSP Surface Finish

Liu, Hai, Zhang, Jing, Chen, Song, Du, Maohua, Feng, Nufeng, Wang, Qian, Lee, Taekoo

Année:

2007

Langue:

english

Fichier:

PDF, 1.10 MB

english, 2007

18

[IEEE Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings - Austin, TX, USA (5-7 March 1996)] Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings - Optimization of TAB inner lead bonding process

Hgyu Jung,, Taekoo Lee,, Joonghyun Baek,, Hyungho Kim,

Année:

1996

Langue:

english

Fichier:

PDF, 497 KB

english, 1996

19

[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - The Influences of Solder Composition and Pad Finish on the Reliability of Fine Pitch BGA Solder Joints

Zhao, Zhenqing, Wang, Lei, Xie, Xiaoqiang, Wang, Qian, Lee, Taekoo

Année:

2007

Langue:

english

Fichier:

PDF, 2.17 MB

english, 2007

20

thin films

Kim, Woo Jin, Gruenewald, John H., Oh, Taekoo, Cheon, Sangmo, Kim, Bongju, Korneta, Oleksandr B., Cho, Hwanbeom, Lee, Daesu, Kim, Yoonkoo, Kim, Miyoung, Park, Je-Geun, Yang, Bohm-Jung, Seo, Ambrose, N

Journal:

Physical Review B

Année:

2018

Langue:

english

Fichier:

PDF, 2.53 MB

english, 2018